Work package 3: WP 3: MICRO MANUFACTURING FINGER PRINT

Objectives - In WP3 the fingerprint concept will be designed and implemented in the different ESR projects. The process windows and process/product parameters correlation established in WP2 will be used in order to define the fingerprint for all ESR projects. As explained in Section 1.1.2, two types of fingerprint are defined and will be established by the ESR in Task 3.1 and Task 3.2. 

Each ESR will be able to develop either a ‘Product Manufacturing Fingerprint’ or a ‘Process Manufacturing Fingerprint’, or both, depending on which type of fingerprint is more effective towards the realization of zerodefect net-shape micro manufacturing. In WP3, process monitoring and off-line metrology will be employed for the research.

 

Description of Work and Role of Partners

Task 3.1 Product Fingerprint (Lead: POLIMI, Participants: DTU, KUL, UBREM, IPU, USTRAT, UBRAD, TUC, (ALL PARTICIPATING ORGANIZATIONS))

The objective of Task 3.1 is to optimize and ensure the conformance to specifications of all tolerances in the component by means of controlling/measuring selected features (i.e. the product fingerprints). The fingerprints can either be an existing feature of the micro product or an additional test feature embedded in the micro product design (or both) and different options will be evaluated depending on the ESR projects. The ESR wills develop the product manufacturing fingerprint concept in relation to the applications defined for their respective projects.

 

Task 3.2 Process Fingerprint (Lead: TUC, Participants: DTU, KUL, UBREM, IPU, USTRAT, UBRAD, POLIMI, (ALL PARTICIPATING ORGANIZATIONS))

The main objective of Task 3.2 is to further develop the micro manufacturing processes maintaining the production in control by monitoring specific process parameters particularly influencing product variation. Effective process monitoring will control the presence of one or more ‘Process Manufacturing Fingerprint’ on these influencing variables which are measured by sensors either integrated in the process (i.e. cavity pressure sensors) or in the machines (i.e. displacement sensors). This will allow for real-time process control aiming at zero-defect micro manufacturing.

http://www.microman.mek.dtu.dk/Work-packages/Work-package-3
19 NOVEMBER 2017